This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. Topic coverage includes: Failure Analysis Process Flow; Failure Verification; Failure Modes and Failure Classification; Special Devices (MEMS, Optoelectronics, Passives); Fault Localization Techniques: Package Level (NDT); Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods); Deprocessing & Imaging Techniques: Deprocessing; General Imaging Techniques; Local Deprocessing & Imaging; Circuit Edit and Design Modification; Material Analysis Techniques; Reference Information: Important Topics for Semiconductor Devices; Failure Analysis Techniques Roadmap; Failure Analysis Operations and Management; Appendices: Failure Analysis Terms, Definitions, and Acronyms; Industry Standards.